DDR3-1333Unbuffer Non-ECC MemoryCL=9
創見DDR3記憶體以最高品質的原廠DRAM晶片製造，並經嚴格測試篩選，展現高度可靠性、速度和穩定度，確保整體品質與效能穩居業界之冠，也為桌上型電腦提供最經濟的記憶體擴充方案。
Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines.
To ensure that all of its devices can be operated under even the harshest conditions, Transcend utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.
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