DDR3-1600Unbuffer Non-ECC MemoryCL=11
創見JetRam筆電專用記憶體使用經有效測試（ETT）的原廠晶片製作，並經過嚴格的篩選，包括高低溫環境測試，展現優異的相容性與穩定度，並以實惠的價格成為消費者的升級首選。出廠前，所有元件皆須通過不同平台與作業系統版本的實機測試；每一支記憶體模組皆通過不同系統組態測試，包括主流主機板和熱門軟體等。
Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines.
To ensure that all of its devices can be operated under even the harshest conditions, Transcend utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.
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